New User Special Price Expires in

Let's log you in.

Sign in with Facebook


Don't have a StudySoup account? Create one here!


Create a StudySoup account

Be part of our community, it's free to join!

Sign up with Facebook


Create your account
By creating an account you agree to StudySoup's terms and conditions and privacy policy

Already have a StudySoup account? Login here

Microsystems Fab

by: Teagan Klocko MD
Teagan Klocko MD
GPA 3.93

Dean Aslam

Almost Ready


These notes were just uploaded, and will be ready to view shortly.

Purchase these notes here, or revisit this page.

Either way, we'll remind you when they're ready :)

Preview These Notes for FREE

Get a free preview of these Notes, just enter your email below.

Unlock Preview
Unlock Preview

Preview these materials now for free

Why put in your email? Get access to more of this material and other relevant free materials for your school

View Preview

About this Document

Dean Aslam
Class Notes
25 ?




Popular in Course

Popular in Electrical Engineering & Computer Science

This 6 page Class Notes was uploaded by Teagan Klocko MD on Saturday September 19, 2015. The Class Notes belongs to ECE 871 at Michigan State University taught by Dean Aslam in Fall. Since its upload, it has received 65 views. For similar materials see /class/207387/ece-871-michigan-state-university in Electrical Engineering & Computer Science at Michigan State University.

Popular in Electrical Engineering & Computer Science


Reviews for Microsystems Fab


Report this Material


What is Karma?


Karma is the currency of StudySoup.

You can buy or earn more Karma at anytime and redeem it for class notes, study guides, flashcards, and more!

Date Created: 09/19/15
1 ECE 871 SP08 Dean M AslamAssoc Professor 3211 EB ECE Department Michigan State U G eneral I nfo 010108 5173536329 aslammsuedu httpwwwegrmsueduaslam I MicrosystemslMEMS Fabrication MEMS MicroElectroMechanical Systems MSU LECTURE SCHEDULE 1202 EB 0600 0720 pm T Th INSTRUCTOR AVAILABILITY Tuesdays 200 300 pm Thursdays 500 530 pm Office 3211EB Phone 3536329 Email aslammsuedu Website wwwegrmsueduaslam UM LECTURE SCHEDULE Registered students will be added UM website called CTOOIS UM course number is EECS 425 LEARNING OBJECTIVES a Design and Simulation of Microsystems 0 Fabrication and Testing of Microsystems a System Integration and Testing Course Introduction Micro Electro Mechanical Systems MEMS or Microsystems with dimensions in micrometer range are created using microfabrication and micromachining techniques As MEMS are equipped with sensors actuators and microcontrollers they are capable of performing many tasks and functions that involve mechanical electrical optical uidic and other types of signals Sensors and actuators allow us to interface our electronic systems to the nonelectronic world providing analog information through signal conditioning circuits to the microcontroller which interprets the information makes appropriate decisions and implements those decisions via the actuators In most cases a complete MEMS system will also include a wireless interface resulting in Wireless Microsensors Microactuators Integrated Micro Systems WIMS MEMS and WIMS leading to system integration through miniaturization are increasingly finding applications in many areas including automotive health care industrial r monitoring biomedical systems chemical analysis energy sources telecommunication I Interface Chlpsl Morocontronerl aerospace systems consumer appliances and Fig1 MEMSNVIMS components many others For typical applications an integrated MEMS consists of a number of components as shown in Fig 1 Unique Aspects of ECE871 I World39s Best Resources This course using world s finest resources for MEMS fabrication and learning is jointly offered by University of Michigan and MSU participating in the NSFfunded Engineering Research Center ERC for Wireless Integrated Micro Systems WIMS wwwwimsercorg Lecture materials including videos will be available to MSU students from the University of Michigan Prof Wise MSU Prof Aslam and OCW websites MIT Japanese OCW Stanford etc PSAs Involed in CutingEdge Research PhD students from the WIMS ERC are assisting Prof Dean Aslam as PSAs PhD Students Assistants in the Lab and CAD portions of the course at MSU The course instructor and his PSAs are all involved in the cutting edge MEMS research being conducted in the worldclass WIMS Center The PSA are Zongliang Cao caozonglmsuedu Hoyin Chan chanholmsuedu and Jing Lu lujinglmsuedu Unique MEMS Chips o Si MEMS Fabrication a design and testing at MSU b fabrication in Micro and Nano Fab facility at University of Michigan the lead instructor is Prof Najafi of UM Two chips will be designed MEMS chip and circuit chip o Diamond MEMS Fabrication design fabrication and testing at MSU the lead instructor is Dean Aslam The PSAs are Zongliang Cao caozonglmsuedu Hoyin Chan chanholmsuedu and Jing Lu lujinglmsuedu Micros ystems Chips You Create The MSU students create the chips mentioned above using the following plan SELECT A PROJECT SILICON CHIP DIMOND CHIP CIRCUITS MEMS ED NMOS ONLY MEMS SIMULATION AND LAYOUT COVENTORWARE I CIRCUIT SIMULATION PSICEIHSPICE AT MSU ICIRCUIT LAYOUT ANY EDITORI SUBMIT DESIGN To PSIS l SUBMIT DESIGN To UM 1 Disclaimer We do not claim that it is world39s best course Course Outlines 1 Introduction week 12 11 Review ofMEMS Basics MSU 111 Sensors Actuators Instruments 112 Microcontrollers 113 PowerSources 1 1 4 Wireless Interfaces 12 Review ofMEMS Material Fundamentals MSU 121 Crystal Structure and Energy Bands 122 Electrical Mechanical Chemical Optical and Thermal Properties 123 NewMaterials 13 Review of MEMS Modeling MSU 131 MEMS Modeling CAD Package CoventorWare Zongliang Cao caozonglmsuedu Hoyin Chan chanho1msuedu and Jing Lu lujing1msuedu 132 Design Examples Zongliang Cao caozonglmsuedu Hoyin Chan chanho1msuedu and Jing Lu lujing1msuedu 14 Review of MEMS Fabrication Basics MSU 141 IC Fabrication Photolithography Oxidation Doping Film Deposition Wet and Dry Etching Zongliang Cao caozonglmsuedu Hoyin Chan chanho1msuedu and Jing Lu lujing1msuedu 142 MEMS Fabrication Technology of CarbonSi Based Materials Zongliang Cao caozonglmsuedu Hoyin Chan chanho1msuedu and Jing Lu lujing1msuedu Diamond Chip Fabrication 2 MEMSCircuit Design week 16 Scheduquot 21 M08 Basics and inclass Demos MSU leSh deSIgn 0f dlamond tesmhlm eg 21 CMOS Basics and WCass Demos MSU cantilever beam or bridge resonators The 23 Review of MEMS structure and resonance frequency need to be in the Processes Review of M08 and Overview range Of 17 100 The fonowmg f SI MEMS Chi schedule 15 tentative 0 See Appendrx E for prolect groups 24 ReV1ew MOS DevrceCrrcurt Operation Week 7 Introduction Ofthe basic micro SimUIa ony equivalent CimUitsy 910 fabrication experience for the students 2 5 M 08 circuit and sensor designs who have not taken ECE477 Diamond Readout approaches and example seeding using DPR or DW Deposition circuits Mechanics of diaphragm and Metallization Will be done by PSA and beam deflection 2 6 Project circuiVsensor designs and simulations Design optimization and layout Week 8 Spin coat HMDS and 1813 photoresist soft bake and and do quot A develop PR and hard bake wet etch metal dry etch diamond will be 2 7 Circuit and sensor desrgns done by PSA completed Layouts underway lO coums and Chip Sizes SPeCi ed Week 9 Etch SiO2 using buffered HF Optimization underway Design review presentations Final organization of the overall microsystem Local and global pad frames in place KOH etch to release the resonator structure 28 Design Rules for Diamond Chip D Aslam Zongliang Cao Hoyin Chan J Lu 29 Design Discussions D Aslam Zongliang Cao Hoyin Chan J Lu 291 Si Chip nalize design by week 56 292 Diamond Chip nalize design by week 67 3 Microfabrication week 710 31 UM Cleanroom see UM Process Week Schedule by Prof Najafi 32 MSU Cleanroom in Room 3235EB D Aslam Zongliang Cao Hoyin Chan J Lu 321 Diamond Chip Processing for schedule details see the text box on right 322 Lectures Review of Photolithography Oxidation Doping Deposition Wet and Dry Etching Diamond39s Unique Properties Fabricationgrth Techniques Lithography Doping Etching 4 Chip Testing and System Integration weeks 1014 41 Chip Testing Sensor and Actuator Testing 42 Microsystems integration 421 Microcontroller Programming Experiments 4 22 Integration of microcontroller sensors actuators LCD displays power sources etc 43 Nanosystems lecture discussions only Grading Policy Problem Sets and CAD Assignments 20 Quizzes2 30 Individual Midterm Report 20 Individual Final Report 30 Final Exam There will be no final exam but the class will meet during time scheduled for the final examination For final examination schedule and MSU calender see the following website httpwwwregmsueduROlnfoCalendarAcademicasp Final Grade A Gaussian curve will be used for final grading using the percentages shown above In the past class average has been around a grade of 35 The quizzes will be open book and will focus on understanding of the material covered in lectures MSU as well as UM MSU CAD assignments and MSU labs The midterm report due March 14 quot will be an early version of the final report One report per student is required and must be written in your own words meaning that you cannot copy parts of your group member39s report Please note that in the past some students have gotten lower grades because they copied parts of their group members39 report Follow the I There will be a total of 2 3 quizzes and the dates will be announced usually 2 weeks before every quiz procedure described below for the details of the report For the final report you will extend the midterm report to include testing results The final report is due on the day of final examination for date check MSU final examination schedule see website mentioned above One report per student is required The final report must have the following sections if you do not follow the format below the instructor will deduct 10 points and must be written in your own words meaning that you cannot copy parts of your group member39s report please note that in the past some students have gotten lower grades because they copied parts of their group members39 report Introduction introduce your project its importance unique aspects 13 pages ll Literature Review review recent 5 10 years research related to i design simulation fabrication and testing and ii system integration of your class project provide references in the reference section of papers you have used in the review of your project 1O 20 pages Iquot My Work give all details of the work that you have done on the ECE871 project your contribution in design fabrication testing system integration etc highlight clearly the uniques ideascontributions in your project You must clearly highlight your contribution to the team project no page limit IV Conclusions include important conclusions of your project lt 1 page V References use lEEE format for references Prerequisites 1 ECE8 70 ECE4 77 ECE474 or similar courses elswhere 2 A preliminary knowledge of design fabrication anal testing of microsystems will be helpful Computer Aided Design and Modeling Software Through University of Michigan Coventor Inc has partially donated licenses for their Coventorware suite of design and modeling so ware for the sole use of MEMS courses offered by the WIMS center In addition to Coventorware you can also use ANSYS a finiteelement simulation tool that is available at MSU Textbooks and References No textbook is required for this course but we recommend the following books 1 Change Liu Foundations of MEMS PearsonPrenticeHaI 2006 2 Stephen D Senturia Microsystem Design Boston Kluwer 2001 These books will be supplemented by materials both by Professors Najafi and Aslam covering i MEMS design fabrication and testing ii sensor design and fabrication and iii electronic devicecircuit design as well as additional information on relevant microstructures There are many other books that give a good background on devices and circuits For example J P Uyemura F J 39 of MOS Digital I J Circuits New York AddisonWesley 1988 Most projects will want to consult the broader literature in relevant areas See Appendix A for a comprehensive list of references to be used in this course Internet Resources A number Internet based lecture materials will be used in this course including streaming video lectures from the University of Michigan The information on how to access these materials will be supplied in the 2 week of classes See Appendix B for details Appendix A References Reference textbooks A handout provided on the first class day at MSU contains hundreds of references on MEMS literature 2 Gregory TA Kovacs Micromachined Transducers Sourcebook McGraw Hill 1998 3 S M Sze ed Semiconductor Sensors New York John Wiley 1994 4 R S Muller etal Microsensors New York IEEE Press 1991 5 M Madou Fundamental ofMicrofabrication CRC Press Inc Boca Raton FL 1997 6 M Elwensoek H Jansen quot Silicon Micromachining Kluwer Academic Publishers 2001 7 J W Gardner IVIicrosensors 7 Principles and Applications John Wiley amp Sons 1994 Additional reading and Journals 8 KD Wise ed IIicromachined Sensors and Sensing Systems IEEE Proceedings Special issue August 1998 9 IEEE Transactions on Electron Devices Special Issues of December 1979 January 1992 and July 1985 These issues contained many of the seminal papers in the field 10 Digest of Technical Papers International Conferences on SolidState Sensors and Actuators Transducers 30c 1985 IEEE Philadelphia 1987 IEE Japan Tokyo 1989 Elsevier reprinted in Sensors and Actuators Montreux 1991 IEEE San Francisco 1993 IEE Japan Yokohama 1995 Stockholm 1997 Chicago 1999 Sendai Japan 2001 Munich Germany 11 Digest of Technical Papers SolidState Sensor andActuator Workshop Hilton Head SC Series 1984 through 2000 12 Proceedings IEEE Micro Electro Mechanical Systems Workshop IlIEMS Conference 1987 to 13 Digests of Technical Papers IEEE International Electron Devices Meetings IEDIlI This conference contains many of the seminal papers on solidstate image sensors and tracks the development of this and some of the other sensor technologies over the ears 14 Digests of Technical Papers IEEE International SolidState Circuits Conference ISSCC This conference has also served as the focal point for leading edge work particularly in image sensors 15 IEEEASME Journal of Micro Electro Mechanical Systems IEEE JIVIEMS published by the Institute for Electrical and Electronics Engineers See IEEE website at wwwieeeorg 16 Sensors and Actuators Journal A Physical B Chemical and C Materials published by Elsevier Publishing httpwwwelseviercomincapublications l7Journal of Micromechanics and Microengineering J1IampII published by British Institute of Physics httpwwwioporgJournalsjm 18 Sensors and Materials Journal MYU Publishing Japan


Buy Material

Are you sure you want to buy this material for

25 Karma

Buy Material

BOOM! Enjoy Your Free Notes!

We've added these Notes to your profile, click here to view them now.


You're already Subscribed!

Looks like you've already subscribed to StudySoup, you won't need to purchase another subscription to get this material. To access this material simply click 'View Full Document'

Why people love StudySoup

Bentley McCaw University of Florida

"I was shooting for a perfect 4.0 GPA this semester. Having StudySoup as a study aid was critical to helping me achieve my goal...and I nailed it!"

Kyle Maynard Purdue

"When you're taking detailed notes and trying to help everyone else out in the class, it really helps you learn and understand the I made $280 on my first study guide!"

Steve Martinelli UC Los Angeles

"There's no way I would have passed my Organic Chemistry class this semester without the notes and study guides I got from StudySoup."

Parker Thompson 500 Startups

"It's a great way for students to improve their educational experience and it seemed like a product that everybody wants, so all the people participating are winning."

Become an Elite Notetaker and start selling your notes online!

Refund Policy


All subscriptions to StudySoup are paid in full at the time of subscribing. To change your credit card information or to cancel your subscription, go to "Edit Settings". All credit card information will be available there. If you should decide to cancel your subscription, it will continue to be valid until the next payment period, as all payments for the current period were made in advance. For special circumstances, please email


StudySoup has more than 1 million course-specific study resources to help students study smarter. If you’re having trouble finding what you’re looking for, our customer support team can help you find what you need! Feel free to contact them here:

Recurring Subscriptions: If you have canceled your recurring subscription on the day of renewal and have not downloaded any documents, you may request a refund by submitting an email to

Satisfaction Guarantee: If you’re not satisfied with your subscription, you can contact us for further help. Contact must be made within 3 business days of your subscription purchase and your refund request will be subject for review.

Please Note: Refunds can never be provided more than 30 days after the initial purchase date regardless of your activity on the site.