In making computer chips, a 4.00-kg cylindrical ingot of

Chapter 12, Problem 12.123

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In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers 1.12?10?4 m thick. (a) Assuming no waste, how many wafers can be made? (b) What is the mass of a wafer (d of Si ? 2.34 g/cm3 ; V of a cylinder ? ?r 2 h)? (c) A key step in making p-n junctions for the chip is chemical removal of the oxide layer on the wafer through treatment with gaseous HF. Write a balanced equation for this reaction. (d) If 0.750% of the Si atoms are removed during the treatment in part (c), how many moles of HF are required per wafer, assuming 100% reaction yield?

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