Gold is commonly used in semiconductor packaging to form

Chapter , Problem 3.178

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Gold is commonly used in semiconductor packaging to form interconnections (also known as interconnects) that carry electrical signals between different devices in the package. In addition to being a good electrical conductor, gold interconnects are also effective at protecting the heat-generating devices to which they are attached by conducting thermal energy away from the devices to surrounding, cooler regions. Consider a thin film of gold that has a cross section of 60 nm 250 nm. (a) For an applied temperature difference of 20 C, determine the energy conducted along a 1-mlong, thin-film interconnect. Evaluate properties at 300 K. (b) Plot the lengthwise (in the 1-m direction) and spanwise (in the thinnest direction) thermal conductivities of the gold film as a function of the film thickness L for 30 L 140 nm. 2