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Solved: Advances in very large scale integration (VLSI) of

Introduction to Heat Transfer | 6th Edition | ISBN: 9780470501962 | Authors: Theodore L. Bergman ISBN: 9780470501962 111

Solution for problem 10.14 Chapter 10

Introduction to Heat Transfer | 6th Edition

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Introduction to Heat Transfer | 6th Edition | ISBN: 9780470501962 | Authors: Theodore L. Bergman

Introduction to Heat Transfer | 6th Edition

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Problem 10.14

Advances in very large scale integration (VLSI) of electronic devices on a chip are often restricted by the ability to cool the chip. For mainframe computers, an array of several hundred chips, each of area 25 mm2 , may be mounted on a ceramic substrate. A method of cooling the array is by immersion in a low boiling point fluid such as refrigerant R-134a. At 1 atm and 247 K, properties of the saturated liquid are 1.46 104 Ns/m2 , cp 1551 J/kg K, and Pr 3.2. Assume values of Cs, f 0.004 and n 1.7. (a) Estimate the power dissipated by a single chip if it is operating at 50% of the critical heat flux. What is the corresponding value of the chip temperature? (b) Compute and plot the chip temperature as a function of surface heat flux for 0.25 q s/q max 0.90. 10.1

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Anonymous Functions and Plotting ­Syntax is “plot( x, y)” ex . X=1:10 Y=01:0:1.1 ­when you are graphing make sure you use the same number of x and y coordinates ­Multiple Plotting on the same graph: Ex. plot(X,Y,'r­­o') Adding Titles and Axis Labels ­title(‘string’) ­xlabel(‘string’) ­ylabel(‘string’) ­legend(‘string’) ­­­ ex. legend(‘Function 1’, ‘Function 2’) ­if you have 3 data sets put 3 strings in there, separated by commas ­if you put y1=x^2, and x=1:10, it will do matrix multiplication so do y=x.^2 instead ­how to do put your legend in the best place ­­­> legen

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Chapter 10, Problem 10.14 is Solved
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Textbook: Introduction to Heat Transfer
Edition: 6
Author: Theodore L. Bergman
ISBN: 9780470501962

The answer to “Advances in very large scale integration (VLSI) of electronic devices on a chip are often restricted by the ability to cool the chip. For mainframe computers, an array of several hundred chips, each of area 25 mm2 , may be mounted on a ceramic substrate. A method of cooling the array is by immersion in a low boiling point fluid such as refrigerant R-134a. At 1 atm and 247 K, properties of the saturated liquid are 1.46 104 Ns/m2 , cp 1551 J/kg K, and Pr 3.2. Assume values of Cs, f 0.004 and n 1.7. (a) Estimate the power dissipated by a single chip if it is operating at 50% of the critical heat flux. What is the corresponding value of the chip temperature? (b) Compute and plot the chip temperature as a function of surface heat flux for 0.25 q s/q max 0.90. 10.1” is broken down into a number of easy to follow steps, and 146 words. The full step-by-step solution to problem: 10.14 from chapter: 10 was answered by , our top Engineering and Tech solution expert on 09/27/17, 04:59PM. Since the solution to 10.14 from 10 chapter was answered, more than 300 students have viewed the full step-by-step answer. This textbook survival guide was created for the textbook: Introduction to Heat Transfer, edition: 6. Introduction to Heat Transfer was written by and is associated to the ISBN: 9780470501962. This full solution covers the following key subjects: . This expansive textbook survival guide covers 13 chapters, and 1422 solutions.

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