An array of electronic chips is mounted within a
Chapter 7, Problem 7.29(choose chapter or problem)
An array of electronic chips is mounted within a sealedrectangular enclosure, and cooling is implemented byattaching an aluminum heat sink (k?180 W/m?K).The base of the heat sink has dimensions of w1?w2?100 mm, while the 6 fins are of thickness t?10 mmand pitch S?18 mm. The fin length is Lf?50 mm,and the base of the heat sink has a thickness ofLb?10 mm.If cooling is implemented by water flow throughthe heat sink, with u??3 m/s and T??17?C, what isthe base temperature Tbof the heat sink when power dis-sipation by the chips is Pelec?1800 W? The averageconvection coefficient for surfaces of the fins and theexposed base may be estimated by assuming parallelflow over a flat plate. Properties of the water may beapproximated as k?0.62 W/m?K, ??995 kg/m3,cp?4178 J/kg?K, ??7.7310?7m2/s, and Pr5? .2.
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