A novel scheme for cooling computer chips uses a
Chapter , Problem 10.74(choose chapter or problem)
A novel scheme for cooling computer chips uses a thermosyphon containing a saturated fluorocarbon. The chip is brazed to the bottom of a cuplike container, within which heat is dissipated by boiling and subsequently transferred to an external coolant (water) via condensation on the inner surface of a thin-walled tube. The nucleate boiling constants and the properties of the fluorocarbon are provided in 10.23. In addition, kl 0.054 W/m K. (a) If the chip operates under steady-state conditions and its surface heat flux is maintained at 90% of the critical heat flux, what is its temperature T? What is the total power dissipation if the chip width is Lc 20 mm on a side? (b) If the tube diameter is D 30 mm and its surface is maintained at Ts 25C by the water, what tube length L is required to maintain the designated conditions? 10
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