In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon
Chapter 12, Problem 12.128(choose chapter or problem)
In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers 1.1231024 m thick. (a) Assuming no waste, how many wafers can be made? (b) What is the mass of a wafer (d of Si 5 2.34 g/cm3; V of a cylinder 5 pr2h)? (c) A key step in making p-n junctions for the chip is chemical removal of the oxide layer on the wafer through treatment with gaseous HF. Write a balanced equation for this reaction. (d) If 0.750% of the Si atoms are removed during the treatment in part (c), how many moles of HF are required per wafer, assuming 100% reaction yield?
Unfortunately, we don't have that question answered yet. But you can get it answered in just 5 hours by Logging in or Becoming a subscriber.
Becoming a subscriber
Or look for another answer