Consider the thin integrated circuit (chip) of .150.
Chapter 4, Problem 4.34(choose chapter or problem)
Consider the thin integrated circuit (chip) of Problem3.150. Instead of attaching the heat sink to the chipsurface, an engineer suggests that sufficient coolingmight be achieved by mounting the top of the chip onto a large copper (k?400 W/m?K) surface that islocated nearby. The metallurgical joint between thechip and the substrate provides a contact resistance ofR?t,c?5?10?6m2?K/W, and the maximum allowablechip temperature is 85C. If the large substrate temper-ature is T2?25C at locations far from the chip, whatis the maximum allowable chip power dissipation qc?
Unfortunately, we don't have that question answered yet. But you can get it answered in just 5 hours by Logging in or Becoming a subscriber.
Becoming a subscriber
Or look for another answer