One way to cool chips mounted on the circuit boards ofa
Chapter 8, Problem 8.56(choose chapter or problem)
One way to cool chips mounted on the circuit boards ofa computer is to encapsulate the boards in metal framesthat provide efficient pathways for conduction to sup-porting cold plates. Heat generated by the chips is thendissipated by transfer to water flowing through pas-sages drilled in the plates. Because the plates are madefrom a metal of large thermal conductivity (typicallyaluminium or copper), they may be assumed to be at atemperature, Ts,cp (a) Consider circuit boards attached to cold plates ofheight H?750 mm and width L?600 mm, eachwith N?10 holes of diameter D?10 mm. Ifoperating conditions maintain plate temperatures ofTs,cp?32C with water flow at perpassage and Tm,i?7C, how much heat may be dis-sipated by the circuit boards?(b) To enhance cooling, thereby allowing increasedpower generation without an attendant increase insystem temperatures, a hybrid cooling scheme maybe used. The scheme involves forced airflow over theencapsulated circuit boards, as well as water flowthrough the cold plates. Consider conditions forwhich Ncb?10 circuit boards of width W?350 mmare attached to the cold plates and their average sur-face temperature is Ts,cb?47C when Ts,cp?32C. Ifair is in parallel flow over the plates with u??10 m/sand T??7C, how much of the heat generated bythe circuit boards is transferred to the air?
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