An extremely effective method of cooling
Chapter 8, Problem 8.107(choose chapter or problem)
An extremely effective method of cooling high-power-density silicon chips involves etching microchannelsin the back (noncircuit) surface of the chip. The chan-nels are covered with a silicon cap, and cooling ismaintained by passing water through the channels.Consider a chip that is 10 mm?10 mm on a side andin which fifty 10-mm-long rectangular microchannels,each of width W?50?m and height H?200?m,have been etched. Consider operating conditions forwhich water enters each microchannel at a tempera-ture of 290 K and a flow rate of 10?4kg/s, while thechip and cap are at a uniform temperature of 350 K.Assuming fully developed flow in the channel and thatall the heat dissipated by the circuits is transferred to the water, determine the water outlet temperatureand the chip power dissipation. Water properties maybe evaluated at 300 K.
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