Advances in very large scale integration (VLSI) of
Chapter 10, Problem 10.14(choose chapter or problem)
Advances in very large scale integration (VLSI) of elec-tronic devices on a chip are often restricted by the abil-ity to cool the chip. For mainframe computers, an arrayof several hundred chips, each of area 25 mm2, may bemounted on a ceramic substrate. A method of coolingthe array is by immersion in a low boiling point fluidsuch as refrigerant R-134a. At 1 atm and 247 K, proper-ties of the saturated liquid are ??1.46?10?4N?s/m2,cp?1551 J/kg?K, and Pr?3.2. Assume values ofCs,f?0.004 and n?1.7.(a) Estimate the power dissipated by a single chip if itis operating at 50% of the critical heat flux. Whatis the corresponding value of the chip temperature?(b) Compute and plot the chip temperature as a functionof surface heat flux for 0.25?q?s/q?max? .90.
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