A silicon chip of thickness L2.5 mm and
Chapter 10, Problem 10.23(choose chapter or problem)
A silicon chip of thickness L?2.5 mm and thermalconductivity ks?135 W/m?K is cooled by boiling asaturated fluorocarbon liquid (Tsat?57?C) on its sur-face. The electronic circuits on the bottom of the chipproduce a uniform heat flux of ,while the sides of the chip are perfectly insulated.Properties of the saturated fluorocarbon are cp,l?1100 J/kg?K, hg?84,400 J/kg, ?l?1619.2 kg/m3, ?v?13.4 kg/m3, ??8.1?10?3N/m, ?l?440?10?6kg/m?s, and Prl?9.01. In addition, the nucleate boilingconstants are Cs,?0.005 and n?1.7.(a) What is the steady-state temperature Toat the bottom of the chip? If, during testing of the chip,q?ois increased to 90% of the critical heat flux,what is the new steady-state value of To?(b) Compute and plot the chip surface temperatures(top and bottom) as a function of heat flux for0.20?q?o/q?max?0.90. If the maximum allowablechip temperature is 80?C, what is the maximumallowable value of q?o?
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