A novel scheme for cooling computer chips uses
Chapter 10, Problem 10.74(choose chapter or problem)
A novel scheme for cooling computer chips uses athermosyphon containing a saturated fluorocarbon.The chip is brazed to the bottom of a cuplike con-tainer, within which heat is dissipated by boilingand subsequently transferred to an external coolant(water) via condensation on the inner surface of a thin-walled tube . The nucleate boiling constants and the properties ofthe fluorocarbon are provided in 10.23. Inaddition, kl?0.054 W/m?K.(a) If the chip operates under steady-state conditionsand its surface heat flux is maintained at 90% ofthe critical heat flux, what is its temperature T?What is the total power dissipation if the chipwidth is Lc?20 mm on a side?(b) If the tube diameter is D?30 mm and its surfaceis maintained at Ts?25?C by the water, whattube length Lis required to maintain the desig-nated conditions?
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