A novel scheme for cooling computer chips uses | StudySoup

Textbook Solutions for Fundamentals of Heat and Mass Transfer

Chapter 10 Problem 10.74

Question

A novel scheme for cooling computer chips uses athermosyphon containing a saturated fluorocarbon.The chip is brazed to the bottom of a cuplike con-tainer, within which heat is dissipated by boilingand subsequently transferred to an external coolant(water) via condensation on the inner surface of a thin-walled tube . The nucleate boiling constants and the properties ofthe fluorocarbon are provided in 10.23. Inaddition, kl?0.054 W/m?K.(a) If the chip operates under steady-state conditionsand its surface heat flux is maintained at 90% ofthe critical heat flux, what is its temperature T?What is the total power dissipation if the chipwidth is Lc?20 mm on a side?(b) If the tube diameter is D?30 mm and its surfaceis maintained at Ts?25?C by the water, whattube length Lis required to maintain the desig-nated conditions?

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The first step in solving 10 problem number 74 trying to solve the problem we have to refer to the textbook question: A novel scheme for cooling computer chips uses athermosyphon containing a saturated fluorocarbon.The chip is brazed to the bottom of a cuplike con-tainer, within which heat is dissipated by boilingand subsequently transferred to an external coolant(water) via condensation on the inner surface of a thin-walled tube . The nucleate boiling constants and the properties ofthe fluorocarbon are provided in 10.23. Inaddition, kl?0.054 W/m?K.(a) If the chip operates under steady-state conditionsand its surface heat flux is maintained at 90% ofthe critical heat flux, what is its temperature T?What is the total power dissipation if the chipwidth is Lc?20 mm on a side?(b) If the tube diameter is D?30 mm and its surfaceis maintained at Ts?25?C by the water, whattube length Lis required to maintain the desig-nated conditions?
From the textbook chapter Boiling and Condensation you will find a few key concepts needed to solve this.

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Title Fundamentals of Heat and Mass Transfer 7 
Author Theodore L. Bergman; Adrienne S. Lavine; Frank P. Incropera; David P. DeWitt
ISBN 9780470501979

A novel scheme for cooling computer chips uses

Chapter 10 textbook questions

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