Consider the microchannel cooling arrangement of 8.107. | StudySoup

Textbook Solutions for Introduction to Heat Transfer

Chapter 8 Problem 8.109

Question

Consider the microchannel cooling arrangement of 8.107. However, instead of assuming the entire chip and cap to be at a uniform temperature, adopt a more conservative (and realistic) approach that prescribes a temperature of Ts 350 K at the base of the channels (x 0) and allows for a decrease in temperature with increasing x along the side walls of each channel. (a) For the operating conditions prescribed in 8.107 and a chip thermal conductivity of kch 140 W/m K, determine the water outlet temperature and the chip power dissipation. Heat transfer from the sides of the chip to the surroundings and from the side walls of a channel to the cap may be neglected. Note that the spacing between channels, S W, is twice the spacing between the side wall of an outer channel and the outer surface of the chip. The channel pitch is S L/N, where L 10 mm is the chip width and N 50 is the number of channels. (b) The channel geometry prescribed in 8.107 and considered in part (a) is not optimized, and larger heat rates may be dissipated by adjusting related dimensions. Consider the effect of reducing the pitch to a value of S 100 m, while retaining a width of W 50 m and a flow rate per channel of m 1 104 kg/s. 8.110 The

Solution

Step 1 of 5)

The first step in solving 8 problem number 109 trying to solve the problem we have to refer to the textbook question: Consider the microchannel cooling arrangement of 8.107. However, instead of assuming the entire chip and cap to be at a uniform temperature, adopt a more conservative (and realistic) approach that prescribes a temperature of Ts 350 K at the base of the channels (x 0) and allows for a decrease in temperature with increasing x along the side walls of each channel. (a) For the operating conditions prescribed in 8.107 and a chip thermal conductivity of kch 140 W/m K, determine the water outlet temperature and the chip power dissipation. Heat transfer from the sides of the chip to the surroundings and from the side walls of a channel to the cap may be neglected. Note that the spacing between channels, S W, is twice the spacing between the side wall of an outer channel and the outer surface of the chip. The channel pitch is S L/N, where L 10 mm is the chip width and N 50 is the number of channels. (b) The channel geometry prescribed in 8.107 and considered in part (a) is not optimized, and larger heat rates may be dissipated by adjusting related dimensions. Consider the effect of reducing the pitch to a value of S 100 m, while retaining a width of W 50 m and a flow rate per channel of m 1 104 kg/s. 8.110 The
From the textbook chapter Internal Flow you will find a few key concepts needed to solve this.

Step 2 of 7)

Visible to paid subscribers only

Step 3 of 7)

Visible to paid subscribers only

Subscribe to view the
full solution

Title Introduction to Heat Transfer 6 
Author Theodore L. Bergman
ISBN 9780470501962

Consider the microchannel cooling arrangement of 8.107.

Chapter 8 textbook questions

×

Login

Organize all study tools for free

Or continue with
×

Register

Sign up for access to all content on our site!

Or continue with

Or login if you already have an account

×

Reset password

If you have an active account we’ll send you an e-mail for password recovery

Or login if you have your password back