Solved: Pull-strength tests on 10 soldered leads for a
Chapter 9, Problem 8.52(choose chapter or problem)
Pull-strength tests on 10 soldered leads for a semiconductor device yield the following results, in pounds of force required to rupture the bond: 19.8 12.7 13.2 16.9 10.6 18.8 11.1 14.3 17.0 12.5 Another set of 8 leads was tested after encapsulation to determine whether the pull strength had been increased by encapsulation of the device, with the following results: 24.9 22.8 23.6 22.1 20.4 21.6 21.8 22.5 Comment on the evidence available concerning equality of the two population variances.
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