Consider a surface-mount type transistor on a circuitboard | StudySoup

Textbook Solutions for Fundamentals of Heat and Mass Transfer

Chapter 1 Problem 1.71

Question

Consider a surface-mount type transistor on a circuitboard whose temperature is maintained at 35C. Air at 20C flows over the upper surface of dimensions 4 mm x 8 mm with a convection coefficient of 50 W/m2K. Three wire leads, each of cross section 1 mm x 0.25 mm andlength 4 mm, conduct heat from the case to the circuitboard. The gap between the case and the board is 0.2 mm.(a) Assuming the case is isothermal and neglecting radia-tion, estimate the case temperature when 150 mW isdissipated by the transistor and (i) stagnant air or (ii) aconductive paste fills the gap. The thermal conductiv-ities of the wire leads, air, and conductive paste are25, 0.0263, and 0.12 W/mK, respectively. (b) Using the conductive paste to fill the gap, we wish todetermine the extent to which increased heat dissipa-tion may be accommodated, subject to the constraintthat the case temperature not exceed 40C. Options include increasing the air speed to achieve a largerconvection coefficient hand/or changing the leadwire material to one of larger thermal conductivity.Independently considering leads fabricated frommaterials with thermal conductivities of 200 and 400 W/mK, compute and plot the maximum allow-able heat dissipation for variations in hover the range 50 h 250 W/m2K

Solution

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The first step in solving 1 problem number 71 trying to solve the problem we have to refer to the textbook question: Consider a surface-mount type transistor on a circuitboard whose temperature is maintained at 35C. Air at 20C flows over the upper surface of dimensions 4 mm x 8 mm with a convection coefficient of 50 W/m2K. Three wire leads, each of cross section 1 mm x 0.25 mm andlength 4 mm, conduct heat from the case to the circuitboard. The gap between the case and the board is 0.2 mm.(a) Assuming the case is isothermal and neglecting radia-tion, estimate the case temperature when 150 mW isdissipated by the transistor and (i) stagnant air or (ii) aconductive paste fills the gap. The thermal conductiv-ities of the wire leads, air, and conductive paste are25, 0.0263, and 0.12 W/mK, respectively. (b) Using the conductive paste to fill the gap, we wish todetermine the extent to which increased heat dissipa-tion may be accommodated, subject to the constraintthat the case temperature not exceed 40C. Options include increasing the air speed to achieve a largerconvection coefficient hand/or changing the leadwire material to one of larger thermal conductivity.Independently considering leads fabricated frommaterials with thermal conductivities of 200 and 400 W/mK, compute and plot the maximum allow-able heat dissipation for variations in hover the range 50 h 250 W/m2K
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Title Fundamentals of Heat and Mass Transfer 7 
Author Theodore L. Bergman; Adrienne S. Lavine; Frank P. Incropera; David P. DeWitt
ISBN 9780470501979

Consider a surface-mount type transistor on a circuitboard

Chapter 1 textbook questions

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