Consider the conditions of .27. In addition totreating
Chapter 5, Problem 5.28(choose chapter or problem)
Consider the conditions of 5.27. In addition totreating heat transfer by convection directly from thechip to the coolant, a more realistic analysis wouldaccount for indirect transfer from the chip to the sub-strate and then from the substrate to the coolant. The total thermal resistance associated with this indirectroute includes contributions due to the chipsubstrateinterface (a contact resistance), multidimensionalconduction in the substrate, and convection from thesurface of the substrate to the coolant. If this total thermal resistance is Rt = 200 K/W, what is the steady-state chip temperature Tf? Following activation of the chip, how long does it take to come within 1C of this temperature?
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