A silicon chip (k 150 W/mK, 2300 kg/m3, cp700 J/kgK), 10 | StudySoup

Textbook Solutions for Fundamentals of Heat and Mass Transfer

Chapter 7 Problem 7.88

Question

A silicon chip (k ?150 W/m?K, ??2300 kg/m3, cp?700 J/kg?K), 10 mm on a side and 1 mm thick, is con- nected to a substrate by solder balls (k?40 W/m?K,??10,000 kg/m3, cp?150 J/kg?K) of 1-mm diame-ter, and during an accelerated thermal stress test, thesystem is exposed to the flow of a dielectric liquid(k?0.064 W/m?K, ??10?6m2/s, Pr?25). As firstapproximations, treat the top and bottom surfaces of thechip as flat plates in turbulent, parallel flow and assumethe substrate and lower chip surfaces to have a negligi-ble effect on flow over the solder balls. Also assumepoint contact between the chip and the solder, therebyneglecting heat transfer by conduction between thecomponents.(a) The stress test begins with the components at ambi-ent temperature (Ti?20?C) and proceeds withheating by the fluid at T??80?C. If the fluidvelocity is V?0.2 m/s, estimate the ratio of the time constant of the chip to that of a solder ball.Which component responds more rapidly to theheating process?(b) The thermal stress acting on the solder joint is pro-portional to the chip-to-solder temperature differ-ence. What is this temperature difference 0.25 safter the start of heating?

Solution

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The first step in solving 7 problem number 88 trying to solve the problem we have to refer to the textbook question: A silicon chip (k ?150 W/m?K, ??2300 kg/m3, cp?700 J/kg?K), 10 mm on a side and 1 mm thick, is con- nected to a substrate by solder balls (k?40 W/m?K,??10,000 kg/m3, cp?150 J/kg?K) of 1-mm diame-ter, and during an accelerated thermal stress test, thesystem is exposed to the flow of a dielectric liquid(k?0.064 W/m?K, ??10?6m2/s, Pr?25). As firstapproximations, treat the top and bottom surfaces of thechip as flat plates in turbulent, parallel flow and assumethe substrate and lower chip surfaces to have a negligi-ble effect on flow over the solder balls. Also assumepoint contact between the chip and the solder, therebyneglecting heat transfer by conduction between thecomponents.(a) The stress test begins with the components at ambi-ent temperature (Ti?20?C) and proceeds withheating by the fluid at T??80?C. If the fluidvelocity is V?0.2 m/s, estimate the ratio of the time constant of the chip to that of a solder ball.Which component responds more rapidly to theheating process?(b) The thermal stress acting on the solder joint is pro-portional to the chip-to-solder temperature differ-ence. What is this temperature difference 0.25 safter the start of heating?
From the textbook chapter External Flow you will find a few key concepts needed to solve this.

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Title Fundamentals of Heat and Mass Transfer 7 
Author Theodore L. Bergman; Adrienne S. Lavine; Frank P. Incropera; David P. DeWitt
ISBN 9780470501979

A silicon chip (k 150 W/mK, 2300 kg/m3, cp700 J/kgK), 10

Chapter 7 textbook questions

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