In a manufacturing process, a transparent film is being | StudySoup

Textbook Solutions for Introduction to Heat Transfer

Chapter 3 Problem 3.6

Question

In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature T0, a radiant source is used to provide a heat flux q 0 (W/m2 ), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at T and a convection heat transfer coefficient h. (a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. (b) Assume the following conditions: T 20 C, h 50 W/m2 K, and T1 30 C. Calculate the heat flux q 0 that is required to maintain the bonded surface at T0 60 C. (c) Compute and plot the required heat flux as a function of the film thickness for 0 L 1 mm. (d) If the film is not transparent and all of the radiant heat flux is absorbed at its upper surface, determine the heat flux required to achieve bonding. Plot your results as a function of L for 0 L 1 mm.

Solution



(a)

node 1: T0
Node 2: T1
Node 3: Tair

Thermal Resistance 1: R1 = (T2 - T1) / q0
Thermal Resistance 2: R2 = (T3 - T2) / h(T3 - T0)
Thermal Resistance 3: R3 = L / kA

(b)

Substituting given values,

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full solution

Title Introduction to Heat Transfer 6 
Author Theodore L. Bergman
ISBN 9780470501962

In a manufacturing process, a transparent film is being

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