In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature T0, a radiant source is used to provide a heat flux q 0 (W/m2 ), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at T and a convection heat transfer coefficient h. (a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. (b) Assume the following conditions: T 20 C, h 50 W/m2 K, and T1 30 C. Calculate the heat flux q 0 that is required to maintain the bonded surface at T0 60 C. (c) Compute and plot the required heat flux as a function of the film thickness for 0 L 1 mm. (d) If the film is not transparent and all of the radiant heat flux is absorbed at its upper surface, determine the heat flux required to achieve bonding. Plot your results as a function of L for 0 L 1 mm.

Day 5 fprintfThis function is used to format output anything written in single parentheses that becomes a string of text is a string value, or a numerical value see picture below to see the syntax). Example: >> y=input('Enter a number') Enter a number Or >> z = input('Enter Text:','s') Enter Text: Syntax:fprintf(format_string, variables) if you want to use special characters in the string, put ‘/’ In class exercises: Number 3: >> untitled5 f = @(x)(sin(x)).^2+((cos(x)).^2./(sin(x)cos(x))) Enter a number x = [] Y = [] >> untitled5 f = @(x)(sin(x)).^2+((cos(x)).^2./(sin(x)cos(x))) Enter a number[0 pi/8 pi/6 pi/4 pi/2] x = 0